AES is used to determine
the atoms present at a surface, their concentrations, their chemistry, and
their lateral and depth distributions.
Day
1:
•
Introduction – terminology, surfaces, types of surfaces.
0.5 hour
•
The principles of AES – production of Auger electrons, peak labeling,
ionization cross-sections, handbooks, books, backscattering, surface
sensitivity, information depth, sample handling. 2 hours
•
Qualitative analysis – direct and derivative spectra,
identification of elements, energy resolution, peak widths, chemical effects,
plasmons, cross transitions, ion-excited Auger transitions. 2 hours
•
Quantitative analysis – Auger intensities, sensitivity
factors, detection limit, lineshapes, analyzer transmission, electron
multiplier effects, matrix factors, average matrix sensitivity factors,
diffraction, angle of incidence and emission, standard spectra,
signal-to-noise. 3 hours
•
Artifacts –
ionization loss peaks, electron beam damage. 0.5 hours
Day
2:
•
Instrumentation – cylindrical mirror analyzer (CMA),
field emission electron source, hemispherical type analyzer (HSA), modes of
operation, electron detection, pulse counting, other electron sources, vacuum
system, samples, other types of analyzers, scattering in analyzers, energy
scale calibration. 3 hours
•
Imaging – scanning electron microscopy, acceptance
area, locating regions of interest, corrections for topography and
backscattering, beam energy, spatial resolution, comparison of analyzers,
electron energy loss (EELS) imaging, ratioed scatter diagrams, line scans. 2 hours
•
Insulating samples – charge control methods, effects on
images and spectra, use of low energy ion beam. 1 hour
•
Data acquisition, processing and depth profiling – spectrum
subtraction, sputtering, crater edge profiling, angle resolved AES, factor
analysis, linear least squares fitting, sample rotation, mechanical methods. 2 hours
•
Instrument selection and summary – factors to
consider, general summary. 0.2 hours